A new technique for preparing PSG film using RF magnetron sputtering

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6415, Issue , 2007, Pages

  Chandra, Sudhir ^a   Bhatt, Vivekanand ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY DELHI   (India)

Author keywords

Dopant; Glass reflow process; MEMS; Phosphorus doped silicon dioxide; PSG; Surface micromachining; Surface passivation layers

Indexed keywords

DOPING (ADDITIVES); MAGNETRON SPUTTERING; MEMS; PHOSPHORUS; SILICA; SOLID STATE REACTIONS; SURFACE MICROMACHINING;

GLASS REFLOW PROCESS; PHOSPHO SILICSTE GLASS (PSG) FILMS; PHOSPHORUS DOPED SILICON DIOXIDE; SURFACE PASSIVATION LAYERS;

THIN FILMS;

EID: 34247387609     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.696500     Document Type: Conference Paper

References (12)

1. W.Kern and G. L.. Schnable, "Chemically vapor-deposited borophosphosilicate glasses for silicon device applications RCA Rev., 43,423 (1982).
2. S. M. Sze, VLSI Technology, second ed., McGraw-Hill Book Company, New York, Chap. 6, 1988.
3. Akira Takamatsu, Miyoko Shibata, Hideo Sakai, and Takeo Yoshimi, "Plasma-activated deposition and properties of phosphosilicate glass film, " J. Eiectrochem. Soc., 131, 1865-1870 (1984).
4. D. J. Monk, "Hydrofluoric etching of silicon dioxide sacrificial layers," J. Eiectrochem. Soc., 141(1), 264-269 (1994).
5. W.Kem and G. L.. Schnable, RCA Rev., 43, 423 (1982).
6. R. M. Levin and A. C. Adams, "Low Pressure Deposition of Phosphosilicate Glass Films" J. Eiectrochem. Soc., 129(7), 1588-1592(1982).
7. Cynthia L. Pillote, Frank A. Shemansky, Timothy S. Cale and Gregory B. Raupp, "Characterization of phosphosilicate glass films obtained using plasma-enhanced chemical vapor deposition from tetraethylorthosilicate and trimethylphosphite" Thin Solid Films, 236(1-2), 287-293 (1993).
8. Maissel, L., and Glang, R., Handbook of Thin Film Technology, McGraw- Hill, Inc., chap. 15.
9. Ohring, M., Material Science of Thin Films, Deposition and Structure. Mechanical Properties of Thin Films, second ed., Academic Press, New York, Chap. 12, 2002.
10. J. D. Plummer, M. D. Deal and P. B. Griffin, Silicon VLSI Technology, Prentice Hall, Inc, New Jersy, Chap.3, 2000.
11. A.S. Tenney and M. Ghezzo, J. Eiectrochem. Soc., 120, 1091 (1973).
12. V. Bhatt, S. Chandra, S. Kumar, C.M.S. Rauthan and P.N. Dixit, "Stress evaluation of RF sputtered silicon dioxide films for MEMS" to be appear in Indian J .of Pure & Applied Physics.