Copper deposition and dissolution in seemingly parallel electric and magnetic fields: Lorentz force distributions and flow configurations

Journal of Solid State Electrochemistry

Volumn 11, Issue 6, 2007, Pages 687-701

  Cierpka, C ^a   Weier, T ^a   Gerbeth, G ^a   Uhlemann, M ^b   Eckert, K ^c  

^a INSTITUTE OF ION BEAM PHYSICS AND MATERIALS RESEARCH   (Germany)

^b IFW DRESDEN   (Germany)

^c DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Convection; Lorentz force; Magnetoelectrochemistry; Magnetohydrodynamics

Indexed keywords

CURRENT DISTRIBUTION; LORENTZ FORCE DISTRIBUTION; MAGNETOELECTROCHEMISTRY;

DEPOSITION; DISSOLUTION; ELECTRIC FIELD EFFECTS; FINITE ELEMENT METHOD; FLOW PATTERNS; HALL EFFECT DEVICES; MAGNETOHYDRODYNAMICS;

COPPER;

EID: 34147129042     PISSN: 14328488     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10008-006-0215-y     Document Type: Article

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