Rheological behavior of fugitive organic inks for direct-write assembly

Applied Rheology

Volumn 17, Issue 1, 2007, Pages

  Therriault, Daniel ^a   White, Scott R ^b   Lewis, Jennifer A ^b  

^a DEPARTMENT OF CHEMICAL ENGINEERING   (Canada)

^b UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

Direct write; Microfabrication; Organic ink; Structural behavior; Viscoelastic materials

Indexed keywords

ELASTIC MODULI; INK; RELAXATION TIME; RHEOLOGY; VISCOELASTICITY; VISCOSITY;

EID: 34147113482     PISSN: 14306395     EISSN: None     Source Type: Journal    
DOI: 10.1515/arh-2007-0001     Document Type: Article

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