Quantifying electric and magnetic field coupling from integrated circuits with TEM cell measurements

IEEE International Symposium on Electromagnetic Compatibility

Volumn 2, Issue , 2006, Pages 422-425

  Kasturi, V ^a   Deng, S ^a   Hubing, T ^a   Beetner, D ^a  

^a MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

Author keywords

Component; Field coupling; Package

Indexed keywords

DIGITAL INTEGRATED CIRCUITS; ELECTRIC FIELD EFFECTS; ELECTROMAGNETIC COMPATIBILITY; ELECTRONICS PACKAGING; MAGNETIC FIELD EFFECTS; PRINTED CIRCUIT BOARDS; TRANSMISSION ELECTRON MICROSCOPY;

CELL MEASUREMENTS; FIELD COUPLING;

MAGNETIC COUPLINGS;

EID: 34047216701     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/isemc.2006.1706339     Document Type: Conference Paper

References (2)

1. SAE J1752/3 Measurement of Radiated Emissions from Integrated Circuits - TEM/Wideband TEM (GTEM) Cell Method; TEM Cell (150 kHz to 1 GHz), Wideband TEM Cell (150 kHz to 8 GHz), Jan. 2003.
2. IEC 61967-2:2005, "Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions, TEM-cell and wideband TEM-cell method", First edition, Sep. 2005