Wideband SSN suppression and EMI reduction from printed circuit boards using novel planar electromagnetic bandgap structure

IEEE International Symposium on Electromagnetic Compatibility

Volumn 1, Issue , 2006, Pages 151-155

  Jie, Qin ^a   Ramahi, Omar M ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b UNIVERSITY OF WATERLOO   (Canada)

Author keywords

Electromagnetic bandgap (EBG); Electromagnetic interference (EMI); Simultaneous switching noise (SSN)

Indexed keywords

COMPUTER SIMULATION; ENERGY GAP; INTERFERENCE SUPPRESSION; PRINTED CIRCUIT BOARDS; SPURIOUS SIGNAL NOISE;

ELECTROMAGNETIC BANDGAP (EBG); POWER PLANE; SIMULTANEOUS SWITCHING NOISE (SSN);

SIGNAL INTERFERENCE;

EID: 34047209377     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. V. Ricchiuti, "Power-supply decoupling on fully populated high-speed digital PCBs," IEEE Trans. Electromagn. Compat., vol. 43, pp. 671-676, Nov. 2001.
2. M. Xu, T. H. Hubing, J. Chen, T. P. Van Doren, T.P., J. L. Drewniak, and R. E. DuBroff, 'Power-bus decoupling with embedded capacitance in printed circuit board design', IEEE Trans. Electromagn. Compat., 2003, 45, (1), pp. 22-30
3. R. Abhari and G. V. Eleftheriades, "Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits," IEEE Trans. Microw. Theory Tech., vol. 51, no. 6, pp. 1629-1639, Jun. 2003.
4. T. Kamgaing and O. M. Ramahi, "A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface," IEEE Microwave and Wireless Components Letters, Vol. 13, No. 1, pp. 21-23, Jan. 2003.
5. S. Shahpamia and O. M. Ramahi, "Miniaturized Electromagnetic Bandgap Structures for Broadband Switching Noise Suppression in PCBs," Electronics Letters, Vol. 41, No. 9, pp. 519-520, April 2005.
6. F. R. Yang, K. P. Ma, and T. Itoh, "A uniplanar compact photonicbandgap (UC-PBG) structure and its applications for microwave circuits", IEEE Transactions on Microwave Theory and Techniques, Vol. 47 No. 8, pp. 1509-1514 Aug. 1999.
7. T. L. Wu, C. C. Yang, Y. H. Lin, et al. "A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits" IEEE Microwave and Wireless Components Letters, Vol. 15 No.3, pp. 174-176 Mar. 2005.
8. J. Choi, V. Govind, M. Swaminathan, L. Wan, and R. Doraiswami, "Isolation in mixed-signal systems using a novel electromagnetic bandgap (EBG) structure," Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on 2004 pp: 199 - 202
9. T. L. Wu, Y. H. Lin, and S. T. Chen, "A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures," IEEE Microw. Compon. Lett., vol. 14, no. 7, pp. 337-339, Jul. 2004.
10. T. H. Hubing, "Printed circuit board EMI source mechanisms," in Proc. IEEE Int. Symp. Electromagnetic Compatibility, vol. 1, Boston, MA, Aug. 2003, pp. 1-3.
11. M. Leone, "The radiation of a rectangular power bus structure at multiple cavity-mode resonance" IEEE Trans. Electromagn. Compat., vol. 45, pp. 486-492, Aug. 2003.