PCB to chassis grounding graphic architectures for minimizing radiated emissions

IEEE International Symposium on Electromagnetic Compatibility

Volumn 1, Issue , 2006, Pages 47-52

  Moongilan, Dheena ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC FIELDS; GRAPHIC METHODS; INTEGRATED CIRCUIT LAYOUT; INTERCONNECTION NETWORKS; MAGNETIC FILM STORAGE; SPURIOUS SIGNAL NOISE;

CHASSIS DESIGN; DAISY CHAIN; NOISE CURRENTS; RADIATED EMISSIONS;

PRINTED CIRCUIT BOARDS;

EID: 34047197947     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/isemc.2006.1706261     Document Type: Conference Paper

References (5)

1. D. Moongilan "Distributed RF Immunity Hardening Design Approach for Telecommunication Hardware and Installation Sites", Bell Labs Technical Journal", 9(2), pp.51-5 8 (2004)© Lucent Technologies Inc. Published by Wiley Periodicals, Inc.
2. D. Moongilan "Method of partial shielding for controlling cable radiated emissions", 2002 IEEE International symposium on EMC, pp.227 - 232 vol. 1
3. rd Edition McGraw-Hill Book Company, 1993, pp.2-7.
4. D. Moongilan, "Skin-effect modeling of radiated emissions from backplanes", 1996 IEEE International symposium on EMC, pp.332-337
5. John D. Kraus, "Antennas," McGraw-Hill Book Company, 1988, pp. 18