Prognostics modeling of solder joints n in electronic components 12

IEEE Aerospace Conference Proceedings

Volumn 2006, Issue , 2006, Pages

  Simons, Jeffrey W ^a   Shockey, Donald A ^a  

^a SRI INTERNATIONAL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC COMPONENTS; MATERIALS BASED PROGNOSTICS; MECHANICAL CYCLING; PROBABILISTIC MICROMODELS;

CONDITION MONITORING; DC-DC CONVERTERS; ELECTRONIC EQUIPMENT; FAILURE ANALYSIS; FINITE ELEMENT METHOD; THERMAL CYCLING;

SOLDERED JOINTS;

EID: 34047150006     PISSN: 1095323X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. M. Amagai, "Characterization of chip scale packaging materials," Microelectronics Reliability 39 (1999) 1365-1377
2. Intel Performance Characteristics of IC Packages, 1998 Packaging Databook
3. C.G. Schmidt, J.W. Simons, C.H. Kanazawa, and D. Erlich, "Thermal Fatigue Behavior of J-lead Solder Joints,"
4. EEE Transactions on Components, Hybrids, and Manufacturing Technology Part A, Vol. 18, No. 3 (September 1995).
5. LSTC website: www.lstc.com
6. H. D. Solomon,"Fatigue of 60/40 Solder," IEEE Trans., CHMT, 9, 423-433 (1986).