Optical routing for 3D system-on-package

Proceedings -Design, Automation and Test in Europe, DATE

Volumn 1, Issue , 2006, Pages

  Minz, Jacob R ^a   Thyagaraja, Somaskanda ^a   Lim, Sung Kyu ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

OPTICAL WAVEGUIDES; RESOURCE ALLOCATION; ROUTERS; ROUTING ALGORITHMS; SIGNAL PROCESSING; WAVELENGTH DIVISION MULTIPLEXING;

ELECTRICAL WIRELENGTH; OPTICAL ROUTING; SYSTEM-ON-PACKAGES (SOP);

OPTICAL INTERCONNECTS;

EID: 34047122724     PISSN: 15301591     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/date.2006.244180     Document Type: Conference Paper

References (4)

1. R. Tummala, "SOP: what is it and why? a new microsystem-integration technology paradigm-moore's law for system integration of miniaturized convergent systems of the next decade," IEEE Trans. on Advanced Packaging, pp. 241-249, 2004.
2. G. Chang, D. Guidotti, F. Liu, Y. Chang, Z. Huang, V. Sundaram, D. Balaraman, S. Hegde, and R. Tummala, "Chip-to-chip optoelectronics sop on organic boards or packages," IEEE Trans. on Advanced Packaging, pp. 386-397, 2004.
3. C. Seo, A. Chatterjee, and N. Jokerst, "Physical design of optoelectronic system-on-a-package: a CAD tool and algorithms," in Proc. Int. Symp. on Quality Electronic Design, 2005.
4. J. Minz, E. Wong, M. Pathak, and S. K. Lim, "Placement and Routing for 3D System-On-Package Designs," IEEE Trans. on Components and Packaging Technologies, 2005.