Microstructure, hardness, resistivity and thermal stability of sputtered oxide films of AlCoCrCu0.5NiFe high-entropy alloy

Materials Science and Engineering: A

Volumn 457, Issue 1-2, 2007, Pages 77-83

  Huang, Yuan Sheng ^a   Chen, Ling ^b   Lui, Hong Wei ^c   Cai, Ming Hong ^d   Yeh, Jien Wei ^d  

^a Jiangmen Polytechnic   (China)

^b SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

^c GUANGXI UNIVERSITY   (China)

^d NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Hardness; High entropy alloy; Microstructure; Oxide film; Resistivity

Indexed keywords

CRYSTAL MICROSTRUCTURE; ELECTRIC CONDUCTIVITY; ENTROPY; GRAIN GROWTH; HARDNESS; LATTICE CONSTANTS; OXIDE FILMS; SILICON WAFERS; SPUTTER DEPOSITION; THERMODYNAMIC STABILITY;

HIGH-ENTROPY ALLOY; MICRO-HOLE SIZE; RADIO FREQUENCY SPUTTER SYSTEM;

ALUMINUM ALLOYS;

ALUMINUM ALLOYS; CRYSTAL MICROSTRUCTURE; ELECTRIC CONDUCTIVITY; ENTROPY; GRAIN GROWTH; HARDNESS; LATTICE CONSTANTS; OXIDE FILMS; SILICON WAFERS; SPUTTER DEPOSITION; THERMODYNAMIC STABILITY;

EID: 33947701651     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.12.001     Document Type: Article

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