Comparison of simulation and measurement of thermal resistance of surface mounted power packages for high power density ballasts

2005 European Conference on Power Electronics and Applications

Volumn 2005, Issue , 2005, Pages

  Frank, Wolfgang ^a  

^a INFINEON TECHNOLOGIES AUSTRIA AG   (Austria)

Author keywords

Discrete power device; Electronic ballast; Industrial application; Mechatronic

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; HEAT SINKS; MECHATRONICS; SURFACE MOUNT TECHNOLOGY; TRANSISTORS;

DISCRETE POWER DEVICES; ELECTRONIC BALLASTS; HEAT SINKING; POWER ELECTRONIC COMPONENTS;

HEAT RESISTANCE;

EID: 33947662908     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/epe.2005.219312     Document Type: Conference Paper

References (4)

1. W. Frank: Influence of copper area on PCB connected with surface mounted or dual inline power packages; International Conference on Power Electronics, Intelligent Motion, Power Quality, PCIM 2003, Nürnberg, Germany, 2003.
2. Infineon Technologies: SPD01N60C3; Datasheet Rev. 2.1; Infineon Technologies, Germany, 2004.
3. Infineon Technologies: SPN01N60C3; Datasheet Rev, 2.1; Infineon Technologies, Germany, 2003.
4. W. Frank: Comparison of Simulation and Measurement of thermal Resistance of Copper Area on a PCB in Combination with surface mounted or dual inline Power Packages, EPE2003, Toulouse, France, 2003.