Super cooling structures for power electronics

2005 European Conference on Power Electronics and Applications

Volumn 2005, Issue , 2005, Pages

  Raj, Ewa ^a   Lisik, Zbigniew ^a   Langer, Malgorzata ^a   Rudzki, Jacek ^b  

^a LODZ UNIVERSITY OF TECHNOLOGY   (Poland)

^b TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

Author keywords

Efficiency; Thermal design

Indexed keywords

HEAT FLUX; HEAT RESISTANCE; HEAT SINKS; MICROCHANNELS; SUPERCOOLING;

HEAT FLUX DENSITIES; MECHANICAL DEMANDS; SUPERCOOLING STRUCTURES; THERMAL DESIGN;

POWER ELECTRONICS;

EID: 33947630697     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/epe.2005.219381     Document Type: Conference Paper

References (9)

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3. Dau Ges.m.b.H & CO.KG, company web site, http://www.dau-at.at/eng/.
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5. D.B. Tuckerman. R.F.W. Pease. High Performace Heat Sinking for VLSI, IEEE Electron. Devices Lett., vol. EDL-2, pp. 126-129, 1981.
6. K. Goodson et al. Electroosmotic Microchannel Cooling System for Microprocessor, Electronics Cooling, vol.8, No. 4, 2002.
7. Raj E., Lisik Z., Langer M., MicroCool - A Tool to Optimise Micro-Channels, MicroTherm'03,Lodz, 2003, pp.93-97
8. Langer M., Lisik Z., Raj E., Numerical Studies of Jet Liquid Cooling in Electronics, MicroTherm'2000, Zakopane, 2000, pp.68-72.
9. Raj E., Lisik Z., Langer M., The Prototype of the Micro-Channel Cooler Optimised in Simulations, MicroTherm'2003, Łódź, 2003, pp. 99-103