Effects of Ce on microstructure and mechanical properties of pure copper

Materials Science and Engineering: A

Volumn 457, Issue 1-2, 2007, Pages 313-318

  Zhang, Zhenfeng ^a   Lin, Gaoyong ^a   Zhang, Shenghua ^a   Zhou, Jia ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Absorptivity; Cerium; Mechanical properties; Microstructure; Pure copper

Indexed keywords

ANNEALING; CERIUM; COMPOSITION EFFECTS; ELONGATION; HARDNESS; METALLOGRAPHIC MICROSTRUCTURE; TENSILE STRENGTH; YIELD STRESS;

ABSORPTIVITY; PLASMA EMISSIVE SPECTRUM;

COPPER;

ANNEALING; CERIUM; COMPOSITION EFFECTS; COPPER; ELONGATION; HARDNESS; METALLOGRAPHIC MICROSTRUCTURE; TENSILE STRENGTH; YIELD STRESS;

EID: 33947627153     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.12.056     Document Type: Article

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