Motion stages for electronic packaging design and control

IEEE Robotics and Automation Magazine

Volumn 13, Issue 4, 2006, Pages 51-61

  Ding, Han ^a   Xiong, Zhenhua ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Electronic packaging; High accuracy; High speed; Motion stage; Wire bonding

Indexed keywords

ACCELERATION; BONDING; COMPUTER CONTROL SYSTEMS; COMPUTER SIMULATION; MOTION CONTROL; PACKAGING MACHINES; PRODUCT DESIGN;

HIGH ACCURACY; HIGH SPEED; MOTION STAGE; WIRE BONDING;

ELECTRONICS PACKAGING;

EID: 33947401413     PISSN: 10709932     EISSN: None     Source Type: Journal    
DOI: 10.1109/MRA.2006.250562     Document Type: Article

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