Removal of Cu(II) by polypyrrole deposits on stainless steel mesh

Journal of Applied Polymer Science

Volumn 104, Issue 1, 2007, Pages 629-633

  Tian, Ying ^a   Yang, Weishen ^b   Yang, Fenglin ^b  

^a DALIAN JIAOTONG UNIVERSITY   (China)

^b DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Electrochemistry; Kinetics (polym.); Polypyrroles

Indexed keywords

ELECTROCHEMISTRY; MORPHOLOGY; POLYPYRROLES; REACTION KINETICS; STAINLESS STEEL; THERMAL EFFECTS;

POLYPYRROLE ELECTRODES; REGENERATION; STAINLESS STEEL MESH;

COPPER;

COPPER; FILM; KINETICS; MORPHOLOGY; POLYPYRROLE; REMOVAL; STEEL;

EID: 33947237797     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.25632     Document Type: Article

References (6)

1. Piatnicki, C. M. S.; Azambuja, D. S.; Hasse, E. E. S.; et al. Sep Sci Technol 2002, 37, 2459.
2. Alatorre, M. A.; Gutiérresz, S.; Párarno, U. J Appl Electrochem 1998, 28, 551.
3. Rodriguez, F. J.; Gutierrez, S.; Ibanoz, J. G.; Braro, J. L.; Batina, N. Environ Sci Technol 2000, 34, 2018.
4. Wampler, W. A.; Basak, S.; Rajeshmar, K. Carbon 1996, 34, 747.
5. Conroy, K. G.; Breslin, C. B. J Appl Electrochem 2004, 34, 191.
6. Liu, Y.-C.; Hwang, B.-J. J Electroanal Chem 2001, 501, 100.