Lifetime estimation for wire bond interconnections using life-cycle-information modules with implemented models

Proceedings - Fourth International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Eco Design 2005

Volumn 2005, Issue , 2005, Pages 614-619

  Middendorf, A ^a,c   Reichl, H ^a,c   Griese, H ^b,c  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b FRAUNHOFER IZM   (Germany)

^c NONE   (Germany)

Author keywords

Aging models; IGBT reliability; Life cycle unit (LCU); Remaining lifetime estimation; Reuse

Indexed keywords

AGING MODELS; IGBT RELIABILITY; LIFE CYCLE UNIT (LCU); REMAINING LIFETIME ESTIMATION;

INFORMATION SYSTEMS; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); INTERCONNECTION NETWORKS; PRODUCT DESIGN; QUALITY MANAGEMENT; REUSABILITY;

LIFE CYCLE;

EID: 33947177061     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECODIM.2005.1619309     Document Type: Conference Paper

References (8)

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