Microstructures of Al and Cu interconnects

Wuli Xuebao/Acta Physica Sinica

Volumn 56, Issue 1, 2007, Pages 371-375

  Wang, Jun Zhong ^a   Ji, Yuan ^a   Wang, Xiao Dong ^b   Liu, Zhi Min ^a   Luo, Jun Feng ^a   Li, Zhi Guo ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

^b CHINESE PEOPLE S ARMED POLICE FORCE ACADEMY   (China)

Author keywords

EBSD; Electromigration; Interconnect; Microstructure

Indexed keywords

EID: 33847785033     PISSN: 10003290     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)