Characterization and wideband modeling of miniaturized LTCC helical inductors

IEEE Microwave and Wireless Components Letters

Volumn 17, Issue 3, 2007, Pages 160-162

  Heo, Keun ^b,c   Lim, JuHwan ^a,b   Mun, JeDo ^d   Hwang, SungWoo ^a,b  

^a Korea University ^*

^b Korea University   (South Korea)

^c SAMSUNG Electronics   (South Korea)

^d ADMT Co   (South Korea)

Author keywords

Helical inductor; Low temperature co fired ceramic (LTCC); Q factor; Wideband modeling

Indexed keywords

CERAMIC MATERIALS; ELECTROMAGNETIC COUPLING; NATURAL FREQUENCIES; Q FACTOR MEASUREMENT;

HELICAL INDUCTOR; LOW TEMPERATURE CO-FIRED CERAMIC (LTCC); WIDEBAND MODELING;

ELECTRIC INDUCTORS;

EID: 33847779354     PISSN: 15311309     EISSN: None     Source Type: Journal    
DOI: 10.1109/LMWC.2006.890440     Document Type: Article

References (8)

1. L. J. Golonka, "New application of LTCC technology," in Proc. 28th Int. Spring Sem. Election. Technol., 2005, pp. 148-152.
2. W. Blood, F. Ling, T. Myers, and M. Petras, "Library development process for embedded capacitors in LTCC," in Proc. IEEE EPEP, 2000, pp. 147-150.
3. A. Sutono, D. H. Heo, Y.-J. E. Chen, and J. Laskar, "High-Q LTCC based passive library for wireless system-on-package (SOP) module development," IEEE Trans. Microw. Theory Tech., vol. 49, no. 10, pp. 1715-1724, Oct. 2001.
4. T. S. Horng, J. M. Wu, L. Q. Yang, and S. T. Fang, "A novel modified-T equivalent circuit for modeling LTCC embedded inductors with a large bandwidth," in Proc. IEEE MTT-S Int. Dig., 2003, pp. 1015-1018.
5. M. H. Chiou and K. Y. J. Hsu, "A new wideband modeling technique for spiral inductors," Proc. Inst. Elect. Eng., vol. 151, no. 2, pp. 115-120, Apr. 2004.
6. LTCC (Low Temperature Cofired Ceramic) / LTCC-M (Low Temperature Cofired Ceramic on Metal), Multi-Chip Module, MEMS Device Package, 3-D, ADMT Co., Ltd. [Online], Available: http://www.ltcc-m.com
7. D. H. Kwon, J. W. Kim, K. H. Kim, S. C. Choi, J. H. Lim, J.-H. Park, L. Choi, S. W. Hwang, and S. H. Lee, "Characterization and modeling of a new via structure in multilayered printed circuit boards," IEEE Trans. Comp. Packag. Technol., vol. 26, no. 2, pp. 483-489, Jun. 2003.
8. A. Sutono, A. Pham, J. Laskar, and W. R. Smith, "Development of three dimensional ceramic-based MCM inductors for hybrid RF/microwave applications," in IEEE RFIC Symp. Dig., 1999, pp. 175-178.