Effect of extrusion temperature on the physical properties of high-silicon aluminum alloy

Frontiers of Mechanical Engineering in China

Volumn 2, Issue 1, 2007, Pages 120-124

  Yang, Fuliang ^a   Gan, Weiping ^a   Chen, Zhaoke ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Al Si alloy; Electronic package; Hermeticity; Hot extrusion; Rapid solidification; Thermal conductivity; Vacuum canning

Indexed keywords

EID: 33847644489     PISSN: 16733479     EISSN: 16733592     Source Type: Journal    
DOI: 10.1007/s11465-007-0021-y     Document Type: Article

References (9)

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