Novel fabrication technologies of planar nano-gap electrodes for single molecule evaluation

Current Applied Physics

Volumn 7, Issue 4, 2007, Pages 329-333

  Tsutsui, Ken ^a   Nakata, Masashi ^a,c   Morita, Masayuki ^a   Tokuda, Masahide ^a   Nagatsuma, Kazuyuki ^a   Onozato, Harumasa ^a   Kaneko, Tadao ^a   Edura, Tomohiko ^a   Mita, Yoshio ^b   Koinuma, Hideomi ^b,c   Wada, Yasuo ^a,c  

^a WASEDA UNIVERSITY   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

^c JAPAN SCIENCE AND TECHNOLOGY AGENCY   (Japan)

Author keywords

CMP; Nano gap electrode; Planar electrode; Single molecule devices; Wafer bonding

Indexed keywords

CHEMICAL MECHANICAL POLISHING (CMP); NANOGAP ELECTRODES; PLANAR ELECTRODES; SINGLE MOLECULE DEVICES; WAFER BONDING;

DATA PROCESSING; MOLECULAR DYNAMICS; NANOSTRUCTURED MATERIALS; SEMICONDUCTOR DEVICES;

ELECTRODES;

EID: 33847385076     PISSN: 15671739     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.cap.2006.09.005     Document Type: Article

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