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Materials Science and Engineering: A

Volumn 452-453, Issue , 2007, Pages 524-528

Electrochemical corrosion behavior of nanocrystalline copper bulk

(4) Luo, W a Qian, C a Wu, X J a Yan, M a

a ZHEJIANG UNIVERSITY (China)

Author keywords

Corrosion behavior; Defect; Grain size; Nanocrystalline copper

Indexed keywords

CORROSION RESISTANCE; DEFECTS; DISSOLUTION; ELECTROCHEMICAL CORROSION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; NANOCRYSTALLINE MATERIALS; PASSIVATION; PITTING;

INTERGRANULAR ATOMS; PASSIVE FILM; SURFACE ATOMS;

COPPER;

COPPER; CORROSION RESISTANCE; DEFECTS; DISSOLUTION; ELECTROCHEMICAL CORROSION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; NANOCRYSTALLINE MATERIALS; PASSIVATION; PITTING;

EID: 33847320115 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2006.10.123 Document Type: Article

Times cited : (40)

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