Kinetics parameters studies of Co-Fe-B Deposits using multiple regression

MAPE2005: IEEE 2005 International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, Proceedings

Volumn 2, Issue , 2005, Pages 1480-1483

  Hua, Hui He ^a   Chang, Hui Liu ^a   Xiang, Shen ^a   Hai, Hua Li ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Co Fe B ternary alloy; Computer program; Deposition rate; Electroless deposition; Kinetics equation; Multiple regression

Indexed keywords

BORON; COBALT; COMPUTER SOFTWARE; CORRELATION METHODS; ELECTROLESS PLATING; IRON; REGRESSION ANALYSIS;

CO-FE-B TERNARY ALLOY; DEPOSITION RATE; KINETICS EQUATION; MULTIPLE REGRESSION;

THIN FILMS;

EID: 33847314591     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Itabashi T., Nakano H., Akahoshi, H., Electroless deposited CoWB for copper diffusion barrier metal, Interconnect Tedcnology Confercnce, 2002. Proceedings of the IEEE 2002 International, (2002)285-287.
2. Yokoshima, Tokihiko, Kaneko, Daiju et al., Electroless CoNiFeB soft magnetic thin films with high corrosion resistance, Journal of Electroanalytical Chemistly, 491(1-2)(2000)197-202
3. García D., Muñoz JL., Kurlyandskaya G., et al., Induced anisotropy, magnetic domain structure and magnetoimpedance effect in CoFeB amorphous thin film, Journal of Magnetism and Magnetic Materials, 191(3)(1999)339-344.
4. s CoNiFeB thin films, IEEE Transactions on Magnetics, 38 (5) (2002)2228-2230.
5. JIANG Xiaoxia SHEN Wei, The Fundamentals and Practice of Electroless Plating, Beijing National Defence Industry Press (2000).
6. ZENG Yao YAO Shuwei, Electsc plating & Magnetic thickness Tianjing University Press, (1998) 89.