Mesoscale deposition technology for electronics applications

Polytronic 2005: 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Proceedings

Volumn 2005, Issue , 2005, Pages 53-57

  Hedges, Martin ^a   Renn, Mike ^b   Kardos, Mike ^b  

^a Neotech Services MTP   (Germany)

^b OPTOMEC INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ASSEMBLY; CERAMIC MATERIALS; COMPUTER AIDED DESIGN; SUBSTRATES;

CONFORMAL WRITING; MASKLESS MESOSCALE MATERIALS DEPOSITION (M3D); POLYMER DEPOSITION;

ELECTRONICS PACKAGING;

EID: 33847234618     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/POLYTR.2005.1596486     Document Type: Conference Paper

References (0)