Etching characteristics of high-purity aluminum in hydrochloric acid solutions

Materials Science and Engineering: A

Volumn 448-451, Issue , 2007, Pages 348-351

  Oh, Han Jun ^a   Lee, Jong Ho ^a   Ahn, Hong Joo ^b   Jeong, Yongsoo ^c   Park, No Jin ^d   Kim, Seong Su ^e   Chi, Choong Soo ^f  

^a Hanseo University   (South Korea)

^b Korea Atomic Energy Research Institute   (South Korea)

^c Korea Institute of Machine and Materials   (South Korea)

^d Kumoh National Institute of Technology   (South Korea)

^e Samsong Institute   (South Korea)

^f Kookmin University   (South Korea)

Author keywords

Aluminum electrolytic capacitors; Capacitance; Etch tunnel; Impedance spectroscopy

Indexed keywords

ADDITIVES; ELECTROCHEMICAL ETCHING; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY; ELECTROLYTIC CAPACITORS; HYDROCHLORIC ACID; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY;

ALUMINUM ELECTROLYTIC CAPACITORS; ETCH TUNNEL; ETCHING CHARACTERISTICS; ETCHING SOLUTION;

ALUMINUM;

ADDITIVES; ALUMINUM; ELECTROCHEMICAL ETCHING; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY; ELECTROLYTIC CAPACITORS; HYDROCHLORIC ACID; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY;

EID: 33847224454     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.01.159     Document Type: Article

References (10)

1. Scherer J., Magnussen O.M., Ebel T., and Behm R.J. Corros. Sci. 41 (1999) 35-55
2. Alwitt R.S. J. Electrochem. Soc. 134 (1987) 1891-1895
3. Hebert K., and Alkire R.C. J. Electrochem. Soc. 135 (1988) 2447-2451
4. Lee Y.B., Shin D.H., and Nam J. Met. Mater. Int. 10 (2004) 407-410
5. Dyer C.K., and Alwitt R.S. J. Electrochem. Soc. 128 2 (1981) 300-305
6. Flis J., and Kowalczyk L. J. Appl. Electrochem. 25 (1995) 501-507
7. Goad D. J. Electrochem. Soc. 144 (1997) 1965-1971
8. Goehr H. Z. Physik. Chem. N. F. 148 (1986) 105-121
9. Goehr H., Oh H.-J., and Schiller C.-A. GDCh-Monographie Band 2 (1995) 341-348
10. Oh H.-J., Jeong Y., Suh S.-J., Kim Y.-J., and Chi C.-S. J. Phys. Chem. Solids 64 (2003) 2219-2226