Analysis on the phase transition behavior of Cu base bulk metallic glass by electrical resistivity measurement

Materials Science and Engineering: A

Volumn 448-451, Issue , 2007, Pages 521-525

  Ji, Young Su ^a   Chung, Sung Jae ^b   Ok, Myoung Ryul ^b   Hong, Kyung Tae ^b   Suh, Jin Yoo ^b   Byeon, Jai Won ^b   Yoon, Jin Kook ^b   Lee, Kyung Hwan ^b   Lee, Kyung Sub ^a  

^a Hanyang University   (South Korea)

^b Korea Institute of Science and Technology   (South Korea)

Author keywords

Annealing; Crystallization; Electrical resistivity; Metallic glass

Indexed keywords

ANNEALING; CRYSTALLIZATION; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC CONDUCTIVITY MEASUREMENT; INTERMETALLICS; METALLIC GLASS; PHASE TRANSITIONS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS; X RAY SCATTERING;

BULK METALLIC GLASS; ELECTRICAL RESISTIVITY MEASUREMENT; SUPERCOOLED LIQUID REGION;

COPPER ALLOYS;

ANNEALING; COPPER ALLOYS; CRYSTALLIZATION; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC CONDUCTIVITY MEASUREMENT; INTERMETALLICS; METALLIC GLASS; PHASE TRANSITIONS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS; X RAY SCATTERING;

EID: 33847185846     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.02.372     Document Type: Article

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