Conductive adhesives containing Ag-Sn alloys as conductive filler

Polytronic 2005: 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Proceedings

Volumn 2005, Issue , 2005, Pages 7-12

  Toida, Gou ^a   Shirai, Yukio ^a   Mizumura, Noritsuka ^a   Komagata, Michinori ^a   Suzuki, Kenichi ^a  

^a NAMICS CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ELECTRIC RESISTANCE; FILLERS; LEAD; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY; TIN ALLOYS;

CONDUCTIVE FILLER; HIGH DENSITY INTERCONNECTION ASSEMBLIES; IONIC-MIGRATION RESISTANCE; ISOTROPIC CONDUCTIVE ADHESIVES (ICA);

SILVER ALLOYS;

EID: 33847178707     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/POLYTR.2005.1596478     Document Type: Conference Paper

References (7)

1. T. Kawaguchi, "Present and Future of Pb-Free Solders", J. of SHM, vol.11, No.3, pp.10-14, 1995.
2. T. Nakamura, "Lead Free Assemble Technology by Conductive Adhesives", J.of SHM, vol.11, No.3, pp.30-35, 1995.
3. S. Nemoto, "Conductive adhesive for SMT,", J SHM, vol. 12, No.3, pp.15, 1996.
4. J.C. Bolger, J.F. McGovern, and J.M. Sylva, "Conductive epoxy surface mount adhesives for solder replacement," in Proc. Tech. Program Nat. Electron. Packag. Prod Conf., pp.1995, 1991.
5. M. Komagata, K. Yokoyama, Y. Tanaka, and K. Suzuki, "Nickel filled adhesives,", Japan IEMT Symp., pp.429, 1995.
6. M. Ono, Y. Tomura, Y. Bessyo, T. Shiraishi, K. Eda, and T. Ishida, "Bonding resistance of SBB technique," in Proc. Pan Pasific Microelectron. Symp., pp.355, 1997.
7. L. Li, H. Kim, C. Lizzul, I. Sacolick, and J.E. Morris, "Electrical, mechanical, structural, and processing properties of electrically conductive adhesives," IEEE Trans. Comp., Packag., Manufact. Technol., vol.16, pp.843, 1993.