Efficient RF/microwave modeling of discontinuities in chip packages and boards

35th European Microwave Conference 2005 - Conference Proceedings

Volumn 1, Issue , 2005, Pages 4-7

  Ndip, Ivan ^a   John, Werner ^a   Reichl, Herbert ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTROMAGNETIC FIELDS; MICROPROCESSOR CHIPS; MICROWAVES;

CHIP PACKAGES; GEOMETRICAL DISCONTINUITIES; MICROWAVE FREQUENCIES; MICROWAVE MODELING;

ELECTRONICS PACKAGING;

EID: 33847145099     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMC.2005.1608819     Document Type: Conference Paper

References (11)

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