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Volumn 1, Issue , 2005, Pages 573-576

Temperature compensated LiTaO3/sapphire SAW substrate for high power applications

Author keywords

Heat dissipation; LitaO3; Sapphire; SAW; Surface activated bonding; Temperature compensation; US PCS

Indexed keywords

ELASTIC MODULI; ELECTRIC CONDUCTIVITY; HEAT LOSSES; OPTIMIZATION; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

EID: 33847140631     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ULTSYM.2005.1602917     Document Type: Conference Paper
Times cited : (62)

References (9)
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  • 6
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    • Temperature Compensated LiTaO3/Sapphire Bonded SAW Substrate with Low Loss and High Coupling Factor Suitable for US-PCS Application
    • M. Miura, T. Matsuda, Y. Satoh, M. Ueda, O. Ikata, Y. Ebata, and H. Takagi, "Temperature Compensated LiTaO3/Sapphire Bonded SAW Substrate with Low Loss and High Coupling Factor Suitable for US-PCS Application," Proc. IEEE. Ultrason. Symp., pp. 1322-1325, 2004.
    • (2004) Proc. IEEE. Ultrason. Symp , pp. 1322-1325
    • Miura, M.1    Matsuda, T.2    Satoh, Y.3    Ueda, M.4    Ikata, O.5    Ebata, Y.6    Takagi, H.7
  • 7
    • 0041529626 scopus 로고
    • Acta Scripta Metall. Proc
    • T. Suga and K. Miyazawa, Acta Scripta Metall. Proc. Ser. 4, pp. 189, 1990.
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  • 8
    • 0000944433 scopus 로고    scopus 로고
    • Surface activated bonding of silicon wafers at room temperature
    • H. Takagi, K. Kikuchi, R. Maeda, T. R. Chung, and T. Suga, "Surface activated bonding of silicon wafers at room temperature," Appl. Phys. Lett. Vol. 68, No. 16, pp. 2222-2224, 1996.
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    • Takagi, H.1    Kikuchi, K.2    Maeda, R.3    Chung, T.R.4    Suga, T.5
  • 9
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    • Low-temperature direct bonding of silicon and silicon dioxide by the surface activation method
    • H. Takagi, R. Maeda, T. R. Chung, and T. Suga, "Low-temperature direct bonding of silicon and silicon dioxide by the surface activation method," Sensors and Actuators A 70., pp. 164-170, 1998.
    • (1998) Sensors and Actuators A , vol.70 , pp. 164-170
    • Takagi, H.1    Maeda, R.2    Chung, T.R.3    Suga, T.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.