Development of a novel binderless diamond grinding wheel for machining IC chips for failure analysis

Journal of Materials Processing Technology

Volumn 185, Issue 1-3, 2007, Pages 31-37

  Venkatesh, V C ^a   Izman, S ^a  

^a UNIVERSITI TEKNOLOGI MALAYSIA   (Malaysia)

Author keywords

Binderless diamond grinding wheel; IC chips; Infra red optics; Optical glass; Silicon die and chip packaging grinding

Indexed keywords

CHIP SCALE PACKAGES; DIAMOND CUTTING TOOLS; INTEGRATED CIRCUIT MANUFACTURE; MICROPROCESSOR CHIPS; PRODUCT DEVELOPMENT; TRANSISTORS;

BINDERLESS DIAMOND GRINDING WHEEL; CHIP PACKAGING GRINDING; INFRARED OPTICS; SILICON DIE PACKAGING GRINDING;

GRINDING WHEELS;

EID: 33847136303     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2006.03.139     Document Type: Article

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