Fabrication of copper microchannels by the spacer method

Scripta Materialia

Volumn 56, Issue 9, 2007, Pages 781-783

  Hakamada, Masataka ^a   Asao, Yuuki ^a   Kuromura, Tetsumune ^a   Chen, Youqing ^a   Kusuda, Hiromu ^a   Mabuchi, Mamoru ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

Copper; Microchannel; Porous materials; Sintering

Indexed keywords

COPPER; POROUS MATERIALS; POWDER METALS; SINTERING; SURFACE ROUGHNESS;

METAL POWDER SIZE; METALLIC MICROCHANNELS; MICROCHANNEL WALLS; MICROCHANNELS;

ELECTRONICS PACKAGING;

EID: 33847104100     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2007.01.014     Document Type: Article

References (21)

1. Papautsky I., Brazzle J., Swerdlow H., and Frazier A.B. J. Microelectromech. S. 7 (1998) 267
2. Yamada Y., Wen C.E., and Mabuchi M. J. Jpn. Soc. Powder Powder Metall. 50 (2003) 848
3. Ohmi T., Takatoo M., Iguchi M., Matsuura K., and Kudoh M. In: Nakajima H., and Kanetake N. (Eds). JIMIC-4 Porous Metals and Metal Foaming Technology (2005), The Japan Institute of Metals, Sendai 359-364
4. Aartun I., Silberova B., Venvik H., Pfeifer P., Gorke O., Schubert K., and Holmen A. Catal. Today 105 (2005) 469
5. Aartun I., Silberova H.J., Holmen A., Pfeifer P., Gorke O., and Schubert K. Catal. Today 110 (2005) 98
6. Wen C.E., Mabuchi M., Yamada Y., Shimojima K., Chino Y., and Asahina T. Scripta Mater. 45 (2001) 1147
7. San Marchi C., and Mortensen A. Acta Mater. 49 (2001) 3959
8. Zhao Y.Y., and Sun D.X. Scripta Mater. 44 (2001) 105
9. Chou K.S., and Song M.A. Scripta Mater. 46 (2002) 379
10. Brothers A.H., Scheunemann R., DeFouw J.D., and Dunand D.C. Scripta Mater. 52 (2005) 335
11. Hakamada M., Yamada Y., Nomura T., Chen Y., Kusuda H., and Mabuchi M. Mater. Trans. 46 (2005) 2624
12. Mala G.M., and Li D. Int. J. Heat Fluid Flow 20 (1999) 142
13. Qu W., Mala G.M., and Li D. Int. J. Heat Mass Tran. 43 (2000) 353
14. Qu W., Mala G.M., and Li D. Int. J. Heat Mass Tran. 43 (2000) 3925
15. Croce G., and D'Agaro P. J. Phys. D: Appl. Phys. 38 (2005) 1518
16. Shen S., Xu J.L., Zhou J.J., and Chen Y. Energ. Convers. Manage. 47 (2006) 1311
17. Zeng Y., Lee T.S., Yu P., and Low H.T. Mod. Phys. Lett. B 19 (2005) 1559
18. Ji Y., Yuan K., and Chung J.N. Int. J. Heat Mass Tran. 49 (2006) 1329
19. Phung X., Groza J., Stach E.A., Williams L.N., and Ritchy S.B. Mater. Sci. Eng. A 359 (2003) 261
20. Ismagilov I.Z., Ekatpure R.P., Tsykoza L.T., Matus E.V., Rebrov E.V., de Croon M.H.J.M., Kerzhentsev M.A., and Schouten J.C. Catal. Today 105 (2005) 516
21. Zheng H.Y., Liu H., Wan S., Lim G.C., Nikumb S., and Chen Q. Int. J. Adv. Technol. 27 (2006) 925