Selective laser sintering of microwave components

35th European Microwave Conference 2005 - Conference Proceedings

Volumn 1, Issue , 2005, Pages 289-292

  Kinzel, Edward ^a   Sigmarsson, Hjalti ^a   Xu, Xianfan ^a   Chappell, William ^a  

^a Purdue University   (United States)

Author keywords

Lasers; Thick film circuit fabrication; Transmission line resonator

Indexed keywords

DC POWER TRANSMISSION; LASER APPLICATIONS; METALLIZING; MICROSTRIP DEVICES; RESONATORS; SINTERING;

LASER SINTERING; PRINTING INKS; THICK FILM CIRCUIT FABRICATION; TRANSMISSION LINE RESONATORS;

MICROWAVE DEVICES;

EID: 33847095172     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMC.2005.1608850     Document Type: Conference Paper

References (5)

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2. Chopra et al, 1998. Method of Forming Electronic Components. United States patent. 5,724,727.
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4. H. S. Carslaw, J. C. Jaeger, Conduction of Heat in Solids. Oxford University Press, London, 1959
5. S. Ramo, J. R. Whinnery, T. Van Duzer, Fields and Waves in Communication Electronics. John Wiley & Sons, Inc., New York, 1993.