Nano-mechanical creep properties of nanoclay/epoxy composite by nanoindentation

Key Engineering Materials

Volumn 334-335 II, Issue , 2007, Pages 669-672

  Lam, Chun Ki ^a   Lau, Kin Tak ^a   Zhou, Li Min ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

Creep; Nanoindentation; Stress exponent

Indexed keywords

CREEP; EPOXY RESINS; MECHANICAL PROPERTIES; NANOSTRUCTURED MATERIALS; PARAMETER ESTIMATION; STRESS ANALYSIS;

NANOCLAY; NANOINDENTATION; STRESS EXPONENT;

COMPOSITE MATERIALS;

EID: 33847083570     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/0-87849-427-8.669     Document Type: Conference Paper

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