Electrorheological properties of suspensions of silica nanoparticles modified by urea and N,N-dimethylformamide

Colloids and Surfaces A: Physicochemical and Engineering Aspects

Volumn 297, Issue 1-3, 2007, Pages 142-146

  Belza, Tomáš ^a   Pavlínek, Vladimír ^a   Sáha, Petr ^a   Quadrat, Otakar ^b  

^a TOMAS BATA UNIVERSITY IN ZLIN   (Czech Republic)

^b INSTITUTE OF MACROMOLECULAR CHEMISTRY   (Czech Republic)

Author keywords

Electrorheological efficiency; Electrorheology; N,N Dimethylformamide; Nanoparticles; Silica; Suspensions; Urea

Indexed keywords

ELECTRIC FIELD EFFECTS; NANOSTRUCTURED MATERIALS; RHEOLOGY; SOLIDIFICATION; SUSPENSIONS (FLUIDS); UREA;

DYNAMIC YIELD STRESS; ELECTRORHEOLOGICAL EFFICIENCY; ELECTRORHEOLOGY; N,N-DIMETHYLFORMAMIDE;

SILICA;

N,N DIMETHYLFORMAMIDE; NANOPARTICLE; SILICON DIOXIDE; UREA;

ARTICLE; CHEMICAL MODIFICATION; ELECTRIC FIELD; ELECTRORHEOLOGY; FLOW KINETICS; LIQUID; MOLECULAR DYNAMICS; NANOCHEMISTRY; PILOT STUDY; PRIORITY JOURNAL; SOLID;

EID: 33847073006     PISSN: 09277757     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.colsurfa.2006.10.038     Document Type: Article

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