High performance and sub-ambient silicon microchannel cooling

Proceedings of the 4th International Conference on Nanochannels, Microchannels and Minichannels, ICNMM2006

Volumn 2006 A, Issue , 2006, Pages 289-296

  Colgan, E G ^a   Furman, B ^a   Gaynes, M ^a   LaBianca, N ^a   Magerlein, J H ^a   Polastre, R ^a   Bezama, R ^b   Marston, K ^b   Schmidt, R ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT RESISTANCE; INTAKE SYSTEMS; INTEGRATED CIRCUIT MANUFACTURE; MICROSTRUCTURE; SILICON;

CHIP SURFACE TEMPERATURE; FLUORINATED FLUID; INLET TEMPERATURE; MICROCHANNEL DESIGNS;

COOLING SYSTEMS;

EID: 33846970921     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/icnmm2006-96094     Document Type: Conference Paper

References (11)

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