Development of electrochemical mechanical polishing for advanced copper planarization

ECS Transactions

Volumn 1, Issue 11, 2006, Pages 125-133

  Jia, R ^a   Wang, Y ^a   Wang, Z ^a   Tsai, S ^a   Diao, J ^a   Mao, D ^a   Karuppiah, L ^a   Chen, L ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROLYTES; ETCHING; METALLIZING; PH EFFECTS; SURFACE PROPERTIES;

COPPER PLANARIZATION; ELECTROCHEMICAL MECHANICAL POLISHING; REMOVAL PROCESSES;

DIELECTRIC MATERIALS;

EID: 33846815414     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2218484     Document Type: Conference Paper

References (7)

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3. F. Liu et. al., Mater. Res. Soc. Symp. Proc., Vol 867 (2005).
4. S. Tsai, et. al., CAMP, Lake Placid (2004).
5. A. Duboust, et. al., CMPUG (2004).
6. L. Economikos et. al., IITC Proc., 233 (2004).
7. WJ-McG. Tegart, The Electrolytic and Chemical Polishing of Metals, 2nd ed., p.3,Pergamon Press, (1959).