Microstructural characteristics and thermal stability of a NiAl-based near-eutectic alloy fabricated by water-cooled copper mold method

Materials Characterization

Volumn 58, Issue 3, 2007, Pages 296-302

  Li, Hu tian ^a   Guo, Jian ting ^a   Huai, Kai wen ^a   Ye, Heng qiang ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

HIP; Phase transformation; Rapid solidification; Solubility extension; Thermal stability

Indexed keywords

ENERGY DISPERSIVE SPECTROSCOPY; EUTECTICS; HOT ISOSTATIC PRESSING; METALLOGRAPHIC MICROSTRUCTURE; PHASE TRANSITIONS; SCANNING ELECTRON MICROSCOPY; SOLIDIFICATION; THERMODYNAMIC STABILITY; TRANSMISSION ELECTRON MICROSCOPY;

LAMELLAR SPACING; LOCALIZED DESTABILIZATION; NEAR EUTECTIC ALLOY; WATER COOLED COPPER MOLD METHOD;

NICKEL ALLOYS;

EID: 33846811560     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2006.05.004     Document Type: Article

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