Design of air and liquid cooling systems for electronic components using concurrent simulation and experiment

Journal of Electronic Packaging

Volumn 128, Issue 4, 2006, Pages 466-478

  Icoz, Tunc ^a   Verma, Nitin ^b   Jaluria, Yogesh ^b,c  

^a GE GLOBAL RESEARCH   (United States)

^b RUTGERS UNIVERSITY   (United States)

^c ASME   (United States)

Author keywords

Air cooling of electronic systems; Channel flow; Concurrent simulation and experiment; Design optimization; Liquid cooling

Indexed keywords

CHANNEL FLOW; COMPUTER SIMULATION; COOLANTS; ELECTRONIC EQUIPMENT; HEAT TRANSFER; OPTIMIZATION; ROBUSTNESS (CONTROL SYSTEMS);

AIR COOLING OF ELECTRONIC SYSTEMS; CONCURRENT SIMULATION; DE-IONIZED WATER; LIQUID COOLING SYSTEMS;

COOLING SYSTEMS;

EID: 33846651945     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2353284     Document Type: Article

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