High moment materials and fabrication processes for shielded perpendicular write head beyond 200 Gb/in2

IEEE Transactions on Magnetics

Volumn 43, Issue 2, 2007, Pages 609-614

  Chen, Y ^a   Sin, K ^a   Jiang, H ^a   Tang, Y ^a   Sasaki, K ^a   Torabi, A ^a   Wang, L ^a   Park, M ^a   Bai, D ^a   Shen, Y ^a   Luo, P ^a   Liu, F ^a   Stoev, K ^a   Lin, W ^b   Zhu, J ^b  

^a WESTERN DIGITAL CORPORATION   (United States)

^b CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

High moment materials; Lamination; Perpendicular recording; Perpendicular write head; Pole erasure; Wafer fabrication

Indexed keywords

LAMINATING; MAGNETIC ANISOTROPY; MAGNETIC MATERIALS; MAGNETIC MOMENTS; MAGNETIC RECORDING; MAGNETOSTRICTION; REMANENCE;

HIGH MOMENT MATERIALS; PERPENDICULAR RECORDING; PERPENDICULAR WRITE HEADS; POLE ERASURES; WAFER FABRICATION; WAFER PROCESSES;

MAGNETIC HEADS;

EID: 33846611946     PISSN: 00189464     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMAG.2006.888200     Document Type: Article

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