Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly

Microelectronics Reliability

Volumn 47, Issue 2-3, 2007, Pages 215-222

  Van Steenberge, Nele ^a   Limaye, Paresh ^a   Willems, Geert ^a   Vandevelde, Bart ^a   Schildermans, Inge ^b  

^a IMEC   (Belgium)

^b LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; LEAD; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; SOLDERING; THERMODYNAMIC PROPERTIES;

ELECTRONIC ASSEMBLY; FINITE ELEMENT MODELS; LEAD-FREE SOLDERING PROCESSES; TIME CONSTANT;

ELECTRONIC EQUIPMENT;

EID: 33846604252     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.09.010     Document Type: Article

References (4)

1. Tavarez A., et al. Modeling the thermal behavior of solder paste inside reflow ovens. J Electron Packag 125 (2003) 335-346
2. Mahaney H.V. Thermal modeling of the infrared reflow process for solder ball connect (SBC). IBM J Res Develop 37 5 (1993) 609-619
3. Sarvar F., et al. Effective transient process modeling of the reflow soldering process: use of a modeling tool for product and process design. IEEE Trans Comp, Packag, Manufactur Technol - Part C 21 3 (1998) 165-171
4. Lienhard J.H. A heat transfer textbook (1987), Prentice-Hall, New Jersey p. 153-175