Investigation on nondestructive evaluation of pipelines using infrared thermography

The Joint 30th International Conference on Infrared and Millimeter Waves and 13th International Conference on Terahertz Electronics, 2005. IRMMW-THz 2005

Volumn 2, Issue , 2005, Pages 339-340

  Fan, Chunli ^a   Sun, Fengrui ^a   Yang, Li ^a  

^a NAVAL UNIVERSITY OF ENGINEERING   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BOILERS; COMPUTER SIMULATION; NONDESTRUCTIVE EXAMINATION; RESEARCH LABORATORIES; THERMOGRAPHY (IMAGING);

DETECTABILITY; LEAKAGE HOLES; PIPELINE HEAT INSULATION LAYER (PHIL);

HEAT PIPES;

EID: 33846492407     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. C. Fan, et al. "Study on method of inspection and quantitative breakage diagnoses of high voltage line and cable by infrared thermography". Proceedings of Chinese Society for Electrical Engineering, 2005. in press.
2. S. M. Shepard. "Advances in thermographic NOT", Proceedings of SPIE, vol.5074, 2003, 882-887.