System in Package (SiP) technology applications

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages

  Koh, Wei ^a  

^a Kingston Technology Company   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MEMORY-RELATED PACKAGES; MULTICHIP PACKAGE (MCP); NOR FLASH MEMORY TECHNOLOGY; SYSTEM IN PACKAGE (SIP);

COMPUTABILITY AND DECIDABILITY; CONSUMER ELECTRONICS; DATA STORAGE EQUIPMENT; ELECTRONIC COMMERCE; ELECTRONIC EQUIPMENT MANUFACTURE; MULTICHIP MODULES; RELIABILITY; TELECOMMUNICATION;

ELECTRONICS PACKAGING;

EID: 33846307400     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564753     Document Type: Conference Paper

References (4)

1. E. Baldwin, W. Koh, "Materials and Manufacturing Issues in Memory Modules-Wafer Thinning" Panpac Symposium 2004
2. Advanced Semiconductor Engineering (ASE) ChungLi, Stacked Die Technology presentation 2005
3. B. Lewis, P. Houston, and D. Baldwin, "Flip Chip Processing for SiP Applications," APEX2003, Proceedings, Anaheim, CA Feb, 2003
4. E. Beyne, "Multilayer Thin Film Technology," IWOPJD 2002, Amsterdam, September 10, 2002