Packaging: Past, present and future

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages 3-7

  Tummala, Rao R ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Consumer electronics; Convergent Electronics Systems; Integrated circuit packaging; Integrated optoelectronics; Interconnections; Moore's Law; Multichip modules; Optoelectronics; SIP; SOC; SOP

Indexed keywords

CONSUMER ELECTRONICS; DYNAMIC RANDOM ACCESS STORAGE; INTEGRATED CIRCUITS; INTEGRATED OPTOELECTRONICS; MULTICHIP MODULES; OPTOELECTRONIC DEVICES;

CONVERGENT ELECTRONICS SYSTEMS; INTEGRATED CIRCUIT PACKAGING; INTERCONNECTIONS; MOORE'S LAW;

ELECTRONICS PACKAGING;

EID: 33846295889     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564643     Document Type: Conference Paper

References (8)

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