Modeling and simulation of thermal-mechanical characteristics of the packaging of tire pressure monitoring system(TPMS)

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages

  Wang, Xiaojun ^a   Wu, Zhiguo ^b   Liu, Sheng ^a,c  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b Shanghai FineMEMS Inc   (China)

^c Wayne State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AIR; ELECTRONICS PACKAGING; GROUND VEHICLES; PRESSURE EFFECTS; PRESSURE MEASUREMENT; WEAR OF MATERIALS;

AIR PRESSURE; PLASTIC PACKAGING; THERMAL MECHANICAL CHARACTERISTICS; TIRE PRESSURE MONITORING SYSTEM(TPMS); TIRE RINGS;

TIRES;

EID: 33846290264     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564701     Document Type: Conference Paper

References (4)

1. M.Fischer, "Tire Pressure Monitoring", Verlag Moderne Industrie, Landsberg, Germany,2003
2. Hyok J.Song, Hui P.Hsu,Richard Wiese,Timothy Talty, "Modeling signal strength range of TPMS in automobiles", IEEE, 2004.
3. A. Pohl, G.Ostermayer, L.Reindl, F.Seifert, "Monitoring the tire pressure at cars using passive SAW sensors",IEEE Ultrasonics Symposium,1997.
4. C. Kole,etc," UltraLow-Power MonolithicallyIntegrated Capacitive Pressure Sensor for TirePressure Monitoring" IEEE,2004