A new diamond wheel containing boron doped diamond abrasives enabling electrically conductive cutting edge and high thermal stability

Key Engineering Materials

Volumn 291-292, Issue , 2005, Pages 57-62

  Suzuki, K ^a   Iwai, M ^b   Ninomiya, S ^c   Takeuchi, K ^d   Tanaka, K ^e   Tanaka, Y ^a   Uematsu, T ^b  

^a NIPPON INSTITUTE OF TECHNOLOGY   (Japan)

^b TOYAMA PREFECTURAL UNIVERSITY   (Japan)

^c Hokuriku Polytechnic College   (Japan)

^d Noritake Super Abrasive Co Ltd   (Japan)

^e Toshiba Machine Co Ltd   (Japan)

Author keywords

Diamond wheel; Electrically conductive diamond grits; Electrodischarge trueing; Grinding

Indexed keywords

ABRASIVES; BORON; DIAMONDS; GRINDING (MACHINING); GRINDING WHEELS; OPTICAL GLASS; THICK FILMS; WHEELS;

DIAMOND WHEEL; ELECTRICAL CONDUCTIVITY; ELECTRICALLY CONDUCTIVE; ELECTRICALLY CONDUCTIVE DIAMOND; ELECTRODISCHARGES; HIGH THERMAL STABILITY; METAL-BONDED DIAMOND WHEELS; OXIDATION TEMPERATURE;

DIAMOND CUTTING TOOLS;

EID: 33846289291     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/KEM.291-292.57     Document Type: Conference Paper

References (5)

1. Element Six Co. Ltd., Catalog.
2. K.Suzuki, M.Iwai, T.Uematsu, A.Sharma: Development of a Grinding Wheel with Electrically Conductive Diamond Cutting Edges, Advances in Abrasive Technology VI, Proc. of ISAAT2003 (2003) pp.239-244.
3. K.Suzuki, M.Iwai, A.Sharma, T.Uematsu, K.Tanaka, et. al: New Diamond Grinding Wheel with Electrically Conductive Cutting Edges, Advances in Abrasive Technology VII, Proc. of ISAAT2004 (2004) pp.307-312.
4. A.Sharma, M.Iwai, K.Suzuki, T.Uematsu: Low-Wear Diamond Electrode for Micro-EDM of Die-Steel, Advances in Abrasive Technology VII, Proc. of ISAAT2004 (2004) pp.559-564.
5. K.Suzuki, A.Sharma, M.Iwai, T.Uematsu, K.Shoda, M.Kunieda: New Dimond and Frontier Carbon Technology, Vol.14, No.1 (2004) pp.35-44.