Thermal and mechanical properties of dough modeling compound reinforced ethylene propylene diene monomer/silicon rubber composites

Polymer Composites

Volumn 27, Issue 6, 2006, Pages 621-626

  Wu, Weili ^a,b   Chen, Dajun ^a  

^a DONGHUA UNIVERSITY   (China)

^b QIQIHAR UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

HARDNESS; MECHANICAL PROPERTIES; METALLIC MATRIX COMPOSITES; MONOMERS; SCANNING ELECTRON MICROSCOPY; THERMAL EFFECTS;

CURING AGENTS; DOUGH-MODELING COMPOUND (DMC); SILICON RUBBER COMPOSITES;

RUBBER;

EID: 33846209487     PISSN: 02728397     EISSN: 15480569     Source Type: Journal    
DOI: 10.1002/pc.20238     Document Type: Article

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