Thick alumina dielectric films on aluminum through chemically bonded composite sol-gel

Ceramics International

Volumn 33, Issue 3, 2007, Pages 333-336

  Kim, Hyungkeun ^a   Troczynski, Tom ^a  

^a UNIVERSITY OF BRITISH COLUMBIA   (Canada)

Author keywords

A. Sol gel process; C. Dielectric properties; C. Thermal expansion; D. Al2O3

Indexed keywords

ALUMINA; ALUMINUM COMPOUNDS; CERAMIC MATERIALS; CHEMICAL BONDS; DIELECTRIC PROPERTIES; PHOSPHORIC ACID; SOL-GELS; THERMAL EXPANSION;

AL2O3; ALUMINUM PHOSPHATES; COMPOSITE SOL-GELS; THERMAL EXPANSION MISMATCH;

DIELECTRIC FILMS;

EID: 33846197545     PISSN: 02728842     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ceramint.2005.09.019     Document Type: Article

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