Self-assembled bulk metallic glass composite prepared by electro discharge bonding technique

Materials Science and Engineering: A

Volumn 447, Issue 1-2, 2007, Pages 319-323

  Park, J S ^a,b   Cho, J ^b   Kim, D H ^a   Lee, N S ^c   Kim, K B ^c   Lee, W H ^c  

^a Yonsei University   (South Korea)

^b Gwangju Research Center ^*  (South Korea)

^c Sejong University   (South Korea)

Author keywords

BMG; Composite; Electro discharge; Fracture toughness

Indexed keywords

BONDING; CRYSTALLINE MATERIALS; FRACTURE TOUGHNESS; METALLIC MATRIX COMPOSITES; SELF ASSEMBLY;

BULK METALLIC GLASS; ELECTRO DISCHARGE; INPUT ENERGY;

METALLIC GLASS;

BONDING; CRYSTALLINE MATERIALS; FRACTURE TOUGHNESS; METALLIC GLASS; METALLIC MATRIX COMPOSITES; SELF ASSEMBLY;

EID: 33846156533     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.10.028     Document Type: Article

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