Bismuth activity in lead-free solder Bi-In-Sn alloys

Calphad: Computer Coupling of Phase Diagrams and Thermochemistry

Volumn 30, Issue 4, 2006, Pages 431-442

  Brunetti, B ^a   Gozzi, D ^a   Iervolino, M ^a   Piacente, V ^a   Zanicchi, G ^b,c   Parodi, N ^b,c   Borzone, G ^b,c  

^a SAPIENZA UNIVERSITY OF ROME   (Italy)

^b UNIVERSITY OF GENOA   (Italy)

^c Genoa Research Unit of the National Consortium of Materials Science and Technology INSTM   (Italy)

Author keywords

Bi activity; Bi In Sn alloys; DSC; Lead free solders; Mixing enthalpy

Indexed keywords

DIFFERENTIAL SCANNING CALORIMETRY; ENTHALPY; FREE ENERGY; SOLDERING ALLOYS; TERNARY SYSTEMS; THERMODYNAMICS; TORSIONAL STRESS;

LEAD FREE SOLDERS; MIXING ENTHALPY; NONIDEAL SYSTEM; TERNARY ALLOYS;

BISMUTH ALLOYS;

EID: 33845989903     PISSN: 03645916     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.calphad.2006.07.003     Document Type: Article

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