Review on SiC-recycling in wafer sawing operations

InterCeram: International Ceramic Review

Volumn 55, Issue 6, 2006, Pages 430-432

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Author keywords

Centrifuge; Polyethylene glycole; SiC recycling; Silicon carbid; Wafer sawing

Indexed keywords

CENTRIFUGES; POLYETHYLENE GLYCOLS; RECYCLING; SILICON CARBIDE; SILICON WAFERS; SLURRIES;

MULTI WIRE SAWING; SIC-RECYCLING; WAFER SAWING;

SAWING;

EID: 33845927885     PISSN: 00205214     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (8)

1. Beesley, I.G., Schönholzer, U.P., Kerat, U., Tanli, P.: Swiss wafer slicing technology for the global PV market from Meyer Burger AG - Novel trends for the future in photovoltaic wafer. Information of the Meyer + Burger AG
2. de Wild-Scholten, M., Alsema, E.: Towards cleaner solar PV. Refocus September/October 2004, 46-49, www.refocus.net
3. Doelger, D.: Personal information
4. US Patent 6615817: Recycling system of wire saw abrasive grain slurry and centrifugal separators therefore, 2003
5. Information of the SiC-Processing GmbH. www.SiC-processing.com
6. Tiefel H.: Aufbereitung und Recycling von Säge-Slurry aus der Wafer-Produktion in der Solar- und Halbleiterindustrie. Vortrag auf der Tagung Aufbereitung und Recycling des UVR in Freiberg/Sachsen, 13.11.2003
7. Re-Si-CLE: Recycling of silicon rejects from PV production cycle. EU-Project OFES-NO; 01.0311, EC-No: ENK5-CT 2001-00567
8. Nishijimas et al.: Recycling of abrasives from wasted slurry by superconductive magnetic separation. Applied Superconductivity, IEEE Transactions 13 (2003) [2] 1596-1599