Analysis of system-level electromagnetic interference from electronic packages and boards

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn 2005, Issue , 2005, Pages 183-186

  Bracken, J Eric ^a   Polstyanko, Sergey ^a   Bárdi, István ^a   Mathis, Andrew ^a   Cendes, Zoltan J ^a  

^a ANSOFT CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3D FEM MODEL; FULL-WAVE ELECTRICAL BEHAVIOR; PLANAR STRUCTURES;

CHIP SCALE PACKAGES; ELECTRIC PROPERTIES; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; PRINTED CIRCUIT BOARDS; PROBLEM SOLVING;

SIGNAL INTERFERENCE;

EID: 33845889723     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2005.1563732     Document Type: Conference Paper

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