Extraction of frequency dependent RLCG parameters of the packaging interconnects on low-loss substrates from frequency domain measurements

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn 2005, Issue , 2005, Pages 25-28

  Guang, Chen ^a   Lin, Zhu ^a   Melde, Kathleen L ^a  

^a University of Arizona   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FREQUENCY DEPENDENCY; LOW LOSS SUBSTRATES; PACKAGING INTERCONNECTS; RLCG;

CALIBRATION; ELECTRIC CONNECTORS; ELECTRIC LINES; ELECTRONICS PACKAGING; PARAMETER ESTIMATION;

FREQUENCY DOMAIN ANALYSIS;

EID: 33845869291     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2005.1563691     Document Type: Conference Paper

References (6)

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